
【虹科方案】IDS 精密視覺系統助力 Micro-LED 轉移與 HBM 封裝製程升級
虹科整合 IDS uEye CP 工業相機,全面提升 Micro-LED 巨量轉移、雷射焊接與 HBM 高精度晶片鍵合製程。透過 2000 萬及 1200 萬像素 STARVIS 感測器,實現亞微米級對位、高速貼裝與 24/7 製程穩定性,已獲多家亞洲電子與半導體領導企業採用。
The field operations industry is undergoing major changes:The complexity of the equipment to be maintained is increasing, but the retirement of 60%'s technical backbone is expected soon.
Hongke Augmented Reality (AR) Smart Glasses throughConnecting Frontline Technicians with AI Databases and Remote ExpertsProvidesHands-free, real-time technical support and trainingIt is also a great way to improve production efficiency and operational safety.

As technology continues to evolve, the variety of products and technical complexity faced by frontline technicians continues to rise.
Hongke AR Smart Glasses are available:
Many field technicians still rely on paper manuals and manual record keeping, resulting in inefficient and error-prone processes.
HONGKE AR Smart Glasses support the convenientAudio and video recording functionMore importantly, the organizationHands-free interactive interface between corporate digital content (e.g., detailed operating instructions, schematics, instructional videos) and on-site techniciansThe operation is intuitive and efficient.

According to statistics.25%'s customer service needs require a second on-site visit to be satisfiedThis is often due to inadequate training, lack of experience or difficulties in accessing information.
AR Smart Glasses through Hongke, EnterpriseTraining courses can be conducted remotelyThe technology can be deployed at a single site or synchronized across multiple sites. Technicians are able toReceive real-time interactive guidance and supervision from instructors or senior staff, realizing "learning by doing".

Hongke AR smart glasses not only solve the current pain points, but also help enterprises to build future-oriented technical capabilities.We are able to meet the dual challenges of equipment complexity and talent gap.

虹科整合 IDS uEye CP 工業相機,全面提升 Micro-LED 巨量轉移、雷射焊接與 HBM 高精度晶片鍵合製程。透過 2000 萬及 1200 萬像素 STARVIS 感測器,實現亞微米級對位、高速貼裝與 24/7 製程穩定性,已獲多家亞洲電子與半導體領導企業採用。

虹科助力 dSPACE 構建基於 GNSS 的駕駛功能 HIL 仿真系統,支援自動駕駛、V2X、智慧座艙等多場景測試。透過 GNSS 模擬器與 ASM 模型,實現精準定位仿真、RF 射頻輸出、高一致性 HIL 驗證,加速自動駕駛演算法開發與測試效率。

面向電動車 BMS 的通信升級方案:虹科 10BASE-T1S 媒體網關支援 CAN/CAN FD ↔ 10BASE-T1S 雙向轉換、PLCA 確定性延遲、單對線多點拓撲與 10 Mbps 帶寬,簡化佈線、提升採樣速率,並透過 Web Server、DIP、C SDK 靈活配置,兼顧成本與可擴展性。