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IDS Precision Vision System for Micro-LED Transfer and HBM Package Upgrade

HONGKEI integrates IDS uEye CP industrial camera to enhance Micro-LED mass transfer, laser soldering and HBM high-precision wafer bonding processes. The 20 and 12 megapixel STARVIS sensors enable sub-micron alignment, high-speed mounting and 24/7 process stability, and have been adopted by a number of leading electronics and semiconductor companies in Asia.

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