IDS Precision Vision System for Micro-LED Transfer and HBM Package Upgrade
HONGKEI integrates IDS uEye CP industrial camera to enhance Micro-LED mass transfer, laser soldering and HBM high-precision wafer bonding processes. The 20 and 12 megapixel STARVIS sensors enable sub-micron alignment, high-speed mounting and 24/7 process stability, and have been adopted by a number of leading electronics and semiconductor companies in Asia.
