The Micro-LED laser soldering machine is designed for high speed and accurate transfer operations on large substrates (e.g. G4.5, G6 glass). Laser welding minimizes thermal and mechanical stresses, and is especially suited for applications where thousands of micro components are handled simultaneously.

Substrate positioning and precision motion control

The camera is first responsible for acquiring global datum marks to establish the relative position of the substrate in the machine's coordinate system; the positioning information is then transmitted to the motion control system so that the overall mechanism can be ±1 µm repeatability Completes high-precision movements.

Fine-tuning and Dynamic Alignment

After the fitting stage, the camera performs datum acquisition to realize the Real-time sub-micron alignmentIt also automatically performs dynamic rotation correction when necessary. This critical information guides the motion system to make position/angle corrections to ensure that each Micro-LED is perfectly aligned with the target pixel.

This system has a capacity of up to 10 million wafers per hour (cph).The combination of extremely high precision and large-scale mass production capability is an important KPI for expanding Micro-LED volume production.

Built-in In-line Inspection

The camera can automatically move to the inspection area to assist the operator with quick quality confirmation, including:

• Accurate wafer lamination
• Is there any tilting, breakage
• Are there any mismatches or anomalies